US chip group makes recommendations for CHIPS Act funding
The Semiconductor Industry Association in the US has submitted comments to the Department of Commerce on how to spend the $52bn agreed for the CHIPS for America Act.
The House and Senate in the US have both passed $52 billion in funding for the CHIPS Act, and now both chambers must reconcile differences in their respective underlying bills and send a compromise version to the President to be signed into law.
The Commerce Department has been looking for direction on semiconductor manufacturing incentives, the proposed expansion of the lab-to-fab pipeline with the establishment of a National Semiconductor Technology Centre and National Advanced Packaging Manufacturing Program.
The SIA has emphasized the need for timely action on manufacturing incentives to fill in gaps and vulnerabilities in the semiconductor supply chain, as well as a broader focus on fabs, packaging facilities, and research labs, as well as equipment and materials suppliers. This was also highlighted by Intel’s plans in Europe, which included plans for fabs in Madgeburg and packaging and assembly plants in France and Italy.
The SIA also highlighted the value of industry direction and coordination at the highest levels of leadership for new pre-competitive research and prototyping efforts, which has been the focus of the European Commission.
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